发明名称 |
Semi-conductor wafer fabrication |
摘要 |
A method of planarizing a semiconductor wafer includes applying a CMP process to a layer of dielectric material to planarize the wafer surface, and applying a plasma etching process to the wafer surface until a signal is generated from a detection layer that indicates that said detection layer has been removed from underlying features disposed on the water.
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申请公布号 |
US2005074907(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20030679841 |
申请日期 |
2003.10.06 |
申请人 |
KRIZ ADRIAN;MONROE MICHAEL |
发明人 |
KRIZ ADRIAN;MONROE MICHAEL |
分类号 |
H01L21/00;H01L21/3105;H01L21/66;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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