发明名称 VACUUM DEPOSITION METHOD FOR ALLOY
摘要 PROBLEM TO BE SOLVED: To deposit an alloy thin film whose alloy film composition is uniform and film thickness precision is high by a vacuum deposition method, in an electronic component comprising an alloy thin film, and to provide an electronic component having high reliability. SOLUTION: In the vacuum deposition method where an alloy film composed of at least two kinds of metals is deposited, a vapor deposition source is provided by an amount larger than that consumed in one batch. Regarding the composition of the vapor deposition source, compared with the composition of the alloy film, the content of the metal having low vapor pressure is made high. Also, regarding the composition of the alloy supplied for the vapor deposition source after the vapor deposition treatment, compared with the composition of the alloy film, the content of the metal having low vapor pressure is made low. Further, the amount of the alloy to be supplied is equivalent to the one consumed by the vapor deposition treatment. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005089822(A) 申请公布日期 2005.04.07
申请号 JP20030324790 申请日期 2003.09.17
申请人 MURATA MFG CO LTD 发明人 SAKAGUCHI KENJI
分类号 C23C14/24;C22C19/05;C22C21/00;H01L21/285;(IPC1-7):C23C14/24 主分类号 C23C14/24
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