PROCESS FOR LAMINATING A DIELECTRIC LAYER ONTO A SEMICONDUCTOR,申请号WO2004US31971-传众专利搜索

发明名称	PROCESS FOR LAMINATING A DIELECTRIC LAYER ONTO A SEMICONDUCTOR
摘要	<p>This invention relates to processes useful for fabricating electronic devices, more particularly to a process for laminating a layer of dielectric material onto a semiconductor.</p>
申请公布号	WO2005031890(A1)	申请公布日期	2005.04.07
申请号	WO2004US31971	申请日期	2004.09.24
申请人	E.I. DUPONT DE NEMOURS AND COMPANY;METH, JEFFREY;NUNES, GEOFFREY;SHARP, KENNETH;WHELAND, ROBERT	发明人	METH, JEFFREY;NUNES, GEOFFREY;SHARP, KENNETH;WHELAND, ROBERT
分类号	H01L21/336;H01L21/34;H01L21/441;H01L21/47;H01L21/768;H01L29/49;H01L29/786;H01L51/05;(IPC1-7):H01L51/20;H01L29/86	主分类号	H01L21/336
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