SEMICONDUCTOR DEVICE CONTAINING STACKED SEMICONDUCTOR CHIPS AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor device and a manufacturing method thereof are provided to improve the adhesiveness between stacked semiconductor chips by using a plasma treated surface. A semiconductor device includes a first semiconductor chip(410) and a second semiconductor chip(430) on the first semiconductor chip. At this time, an upper surface of the first semiconductor chip is a plasma treated surface, so that the second semiconductor chip is loaded on the plasma treated surface. The plasma treated surface includes a surface of an adhesive layer(411).