| 摘要 |
An electronic parts-embedded substrate and a fabrication method thereof are provided to mount an electronic part having a high reliability at low cost while the electronic part is buried in an insulating film, without any inconvenience, thereby improving reliability on crack resistance. A wire substrate comprises a connection pad. Bumps(24a) are flip chip-connected to the connection pad in the first electronic parts(24). Bumps(26a) of the second electronic parts(26) which is bigger than the first electronic parts(24), are flip chip-connected to a connection pad disposed on a peripheral outer side of the first electronic parts(24). The second electronic parts(26) is mounted at certain intervals on the top of the first electronic parts(24). A charging insulator(28) is charged in a gap between the first electronic parts(24) and the wire substrate, and a gap between the second electronic parts(26) and the first electronic parts(24) and the wire substrate. The first electronic parts(24) is buried in the charging insulator(28). |
