Bottom fixation type integrated circuit chip cooling structure

摘要

A bottom fixation type integrated circuit chip cooling structure device. The device is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between the top and bottom plate member, and connecting members are provided between the top and bottom plate members each having a bottom end passed through a respective through hole in the bottom plate member and a bottom screw hole in the bottom end for mounting. A heat sink is bonded to the top surface of the top plate member, and an internally sintered metal capillary wick is provided within the vapor chamber.