| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a multilayer printed wiring board, capable of reducing the production man-hours. SOLUTION: In the process for producing a multilayer printed wiring board by laying works provided with a wiring pattern in layers, respective layers are combined, such that the layer arrangement of wiring pattern becomes symmetric at the center part of the layer (between L3 and L4). COPYRIGHT: (C)2005,JPO&NCIPI |
