发明名称 Heat sink with electrically-insulating, thermally-conductive layer on which semiconductor components are mounted, comprises metallic body with surface-oxidation
摘要 <p>The body (10) is made of metallic material or includes a layer of metallic material. Electrical components (2) are arranged on its upper surface. An electrically-insulating oxide layer (12) completely covers the body, or alternatively forms localized islands upon it. The layer insulates the components. It is an oxide layer, formed by oxidation of the metallic material. The body is aluminum, the insulant is aluminum oxide. The layer forms a substrate or circuit board for fastening of electronic components in good thermal contact.</p>
申请公布号 DE10339692(A1) 申请公布日期 2005.03.31
申请号 DE2003139692 申请日期 2003.08.28
申请人 EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH 发明人 PASSE, THOMAS
分类号 H01L23/367;H01L23/373;H05K1/05;(IPC1-7):H05K1/05;H05K7/20;H05K3/44 主分类号 H01L23/367
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