Device for electrical connection between two wafers and fabrication process of a microelectronic component comprising such a device

摘要

A device for electrical connection between first and second wafers comprises at least first and second contact elements respectively integral to opposite faces of the first and second wafers. The first contact element comprises a salient zone whereas the second contact element is formed by a beam suspended above a cavity formed in the second wafer. The salient zone has a smaller width than the width of the cavity and it can form a stud or a rib. Once the first and second wafers have been assembled, the salient zone and beam come into contact above the cavity and the pressure exerted by the salient zone generates a deformation of the beam, making it flexible.