发明名称 IC socket assembly
摘要 Deformation of a socket housing during connection of an IC package is prevented, and reliable electrical connections are secured in an IC socket assembly. The IC socket assembly is constituted by a plurality of electrical contacts; an insulative socket housing for holding the electrical contacts arranged in a matrix; a reinforcing plate having an opening at its center, through which the electrical contacts are exposed, for supporting the lower portion of the socket housing; a cover member, which is rotatably supported by the reinforcing plate, for cooperating with the reinforcing plate to sandwich and hold the IC package therebetween and to press the IC package against the electrical contacts; and reinforcing beams, which are supported by the reinforcing plate and provided across opposing edges of the opening, for supporting the socket housing.
申请公布号 US2005068752(A1) 申请公布日期 2005.03.31
申请号 US20040955440 申请日期 2004.09.30
申请人 HASHIMOTO SHINICHI;SHIRAI HIROSHI 发明人 HASHIMOTO SHINICHI;SHIRAI HIROSHI
分类号 H01R33/76;H01R33/97;H05K7/10;(IPC1-7):H05K1/11 主分类号 H01R33/76
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