| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip BGA packaging construction by which higher electrical performance is attained by a thinner package. SOLUTION: A metal substrate includes an opening for chip placement having a chip placement region, a distribution region and a vacuum region. The distribution region and the vacuum region are arranged to adjoin each other at an opposite corner as a pair of regions with the chip placement region, a thin-film interconnecting layer is formed on the metal substrate, a BUM layer is formed on the thin-film interconnecting layer, a flip chip is disposed at the chip placement opening and is electrically connected by the thin-film interconnecting layer and a bump, and a solder mask layer is formed on the BUM layer. The solder mask layer exposes a part of a trace layer of the BUM layer at a portion farthest from the metal substrate, fills a gap between the bump and the flip chip with a underfill, and electrically connect a solder ball with the trace layer exposed by the solder mask layer. COPYRIGHT: (C)2005,JPO&NCIPI
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