Semiconductor module and method for producing a semiconductor module

摘要

The present invention provides a semiconductor module having: at least one semiconductor device (10); a rigid covering device (14) over the at least one semiconductor device (10) for protecting and dissipating heat from the at least one semiconductor device (10); and a carrier device (17), which has a connection device (19), for receiving the semiconductor device (10) and the covering device (14), the at least one semiconductor device (10) being electrically coupled to the connection device (19) by means of a flexible contact device (11) via the carrier device (17) and being mechanically coupled to the covering device (14) via a contact device (15, 16). The present invention likewise provides a method for producing a semiconductor module.