| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ball grid array (BGA) package having a semiconductor chip to possess a metal pattern for an edge bonding pad, and to provide a manufacturing method therefor. <P>SOLUTION: On a center bonding type semiconductor chip in which a center bonding pad is formed on the whole surface, the metal pattern for the edge bonding pad which is electrically connected to the pad, and extended in the direction of an edge of the semiconductor chip, is formed. The semiconductor chip is pasted up using an adhesive on a substrate, in which a circuit pattern for electric connection with the exterior is formed, and the metal pattern formed on the semiconductor chip is electrically coupled to the circuit pattern on the substrate by an edge region of the semiconductor chip via a coupling material. After the substrate is molded and packaged to protect the semiconductor chip, the BGA package is manufactured by attaching solder balls to the circuit pattern on the substrate for electrical continuity between the semiconductor chip and an external substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
