| 摘要 |
PROBLEM TO BE SOLVED: To provide a collet chuck which prevents a semiconductor chip from being brought back after carried and misregistration in mounting, and to provide a semiconductor manufacturing device using it. SOLUTION: In a collet chuck 1 wherein a vacuum source is connected to one opening of an elastic body with a suction hole 4 which is opened in both edge faces and a semiconductor chip 5 is sucked and carried by the other opening, the hardness of a collet tip part 3 in contact with the semiconductor chip is higher than the hardness of a collet body 2. COPYRIGHT: (C)2005,JPO&NCIPI
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