| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composition for cast molding with a high content of a filler and having excellent flowing properties, and a method for sealing an electronic device. <P>SOLUTION: This composition for cast molding comprises a thermosetting resin and non-porous, spherical particles, and shows a flowing property of dilatancy. The content of the spherical particles in the composition is preferably 30-80 vol.%. It is preferable that the particles have an average particle size of 2-30μm, and the content of particles with a particle size of not more than 1μm, is not more than 20 wt.%. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
