Method of electrolytically depositing materials in a pattern directed by surfactant distribution

摘要

In accordance with the invention, a surface of a substrate is patterned by the steps of providing the substrate, forming a surfactant pattern on the surface and using electroless deposition or electrodeposition to deposit material on the surface in a pattern directed by the surfactant pattern. The material will preferentially deposit either under the surfactant pattern or outside the surfactant pattern depending on the material and the conditions of deposition. The surfactant pattern is conveniently formed by printing on the surface a surfactant that forms a self assembled monolayer (SAM). The method can be adapted to build complex structures in one, two and three dimensions.