| 摘要 |
PROBLEM TO BE SOLVED: To smoothly take a reinforcing substrate, having a thickness capable of enduring with respect to a polishing work into or out of a wafer cassette. SOLUTION: There are provided a wafer 1, the reinforcement substrate 21 of a ceramic plate or a glass plate attached to the wafer 1, and the wafer cassette 14 having grooves 17, 17 provided therein for accommodating the wafer 1, to which the reinforcing substrate 21 is attached. A slope 26 is formed at the end of the reinforcing substrate 21 with an inclination angle 2°to 10°, corresponding to an inclined side wall 19 of the groove of the wafer cassette 14 and with the length of the slope being set to 0.5 mm to 3 mm. COPYRIGHT: (C)2005,JPO&NCIPI
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