| 摘要 |
A power semiconductor module consists of a ground plate, at least one electrical connecting element separated from the ground plate by a first electrically isolating substrate and at least one overlying sandwich composed of a semiconductor element (11) sandwiched between two flat metal bodies (10, 12), preferably made of molybdenum. At least one pressure element and at least a second electrical connecting element and a housing are also included. <??>The sandwich is centralized on the electrical connection element using a centralizing frame (9) preferably composed of non-conducting plastic so that the second flat metal body (10) is secured against falling out using lugs. The semiconductor element is held by a groove which runs central and parallel to the surface of the centralizing frame (9). <??>The centralizing frame ensures that all the components of the sandwich are centralized in a pressure-free manner. |
