SEMICONDUCTOR WAFER ALIGNMENT APPARATUS AND METHOD

摘要

A semiconductor wafer aligning apparatus and method are provided to detect contaminants on a backside of a wafer while pre-aligning the wafer by using a control unit. A semiconductor wafer aligning apparatus includes a laser emitting unit, a laser receiving unit, a reference value storing unit and a control unit. The laser emitting unit(107) is used for scanning laser on a backside of a wafer while pre-aligning the wafer. The laser receiving unit(109) receives the laser reflected from the wafer backside. The reference value storing unit(215) is used for storing a reference value of luminous energy of the laser in a clean state. The control unit(210) is used for detecting contaminants on the wafer backside by comparing the reference value with real luminous energy of the laser while aligning the wafer.