发明名称 A FABRICATION METHOD OF A SEMICONDUCTOR CAPACITOR HAVING A DIFFUSION-PREVENTING LAYER
摘要 A method of fabricating a semiconductor capacitor having a diffusion barrier is provided to reduce leakage current by eliminating a La-silicate layer from an interface between a bottom electrode and a barrier layer. A bottom electrode(105) is formed on an upper surface of a semiconductor substrate(100). A diffusion barrier(118) is formed on the entire surface of the bottom electrode. A dielectric layer(119) is formed on the diffusion barrier. A thermal process is performed on the semiconductor substrate including the dielectric layer, the diffusion barrier, and the bottom electrode. A top electrode(130) is formed to cover the bottom electrode having the dielectric layer. The diffusion barrier is formed by stacking a barrier layer(113) and an insertion layer(116).
申请公布号 KR20050029427(A) 申请公布日期 2005.03.28
申请号 KR20030065684 申请日期 2003.09.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JONG PYO;LEE, JUNG HYOUNG;LEE, JUNG HYUN;SEO, BUM SEOK
分类号 H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/8242
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