发明名称 PHOTOCURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photocurable resin composition having good surface curability and high adhesive strength. SOLUTION: This photocurable resin composition contains a component (a) comprising a compound having two or more allyl groups (-CH<SB>2</SB>-CH=CH<SB>2</SB>) in its molecule, a component (b) comprising a compound having two or more mercapto groups (-SH) in its molecule, a component (c) comprising a compound having two or more (meth)acryloyl groups in its molecule, and a component (d) comprising a photopolymerization initiator as essential components, wherein a cured product obtained therefrom has a glass transition temperature of≥35°C. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005076018(A) 申请公布日期 2005.03.24
申请号 JP20030312085 申请日期 2003.09.04
申请人 DENKI KAGAKU KOGYO KK 发明人 YODA KIMIHIKO;GOTO KEIJI
分类号 C08F2/38;C08F18/16;C08F20/20;C08F20/36;C08F26/06;C09J4/00;C09J11/00;(IPC1-7):C08F18/16 主分类号 C08F2/38
代理机构 代理人
主权项
地址