发明名称 METHOD OF MANUFACTURING LAMINATE UNIT FOR MULTILAYERED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an improved method of manufacturing a laminate unit of a multilayered electronic component which is configured such that a dielectric layer and an electrode layer are laminated, wherein the penetration of electrode paste into the dielectric layer and the deformation of the dielectric layer and the electrode layer can be prevented and a sheet for an adhesive layer or the like which is required for manufacturing can be used in a form of a roll body without an inverted transfer problem, and a laminate unit sheet includes the adhesive layer and can be obtained in the form of the roll body without the inverted transfer problem. SOLUTION: By conducting transfer processes (first to third processes) and an adhesion process (fourth process) sequentially using a green sheet roll body (1), a roll body (2) for the adhesive layer, and a roll body (3) for the electrode layer (3), each having a specific layer structure, a roll body (4) of a laminated unit sheet (40) having layer structures of a first support sheet/separating layer/print assistant layer/electrode, and a spacer layer/adhesive layer/dielectric layer/[adhesive layer/separating layer/second support sheet/inverted transfer preventing layer] is manufactured. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005079243(A) 申请公布日期 2005.03.24
申请号 JP20030306107 申请日期 2003.08.29
申请人 TDK CORP 发明人 KANASUGI MASAAKI;SATO SHIGEKI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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