| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device whose thermal resistance is small and which can effectively prevent fault by thermal stress. SOLUTION: A plurality of metal plates are arranged in gaps from each other on the other side surfaces 20b, 30b of an endotherm side insulating substrate 20 and/or a heat dissipation side insulating substrate 30. Metal bonding of a cooling (heating) object is performed on the metal plates, so that thermal stress generated in joints is distributed effectively, and it contributes to prevention of breakage. By making an arranged pattern of endotherm side metal plates 41 an arranged pattern of heat dissipation side electrodes 14 and turning an arranged pattern of heat dissipation side metal plates 51 into an arranged pattern of endotherm side electrodes 12, both of the substrates and the metal plates and the electrodes which are arranged on the substrates can be commonalized. COPYRIGHT: (C)2005,JPO&NCIPI
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