| 发明名称 |
Integrated circuit die/package interconnect |
| 摘要 |
A system may include a plurality of pliant conductive elements, a first end of one of the plurality of pliant conductive elements to be electrically coupled to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality of pliant conductive elements to be electrically coupled to a second electrical contact of an integrated circuit die.
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| 申请公布号 |
US2005063164(A1) |
申请公布日期 |
2005.03.24 |
| 申请号 |
US20030667694 |
申请日期 |
2003.09.22 |
| 申请人 |
VANDENTOP GILROY J.;AZIMI HAMID R. |
发明人 |
VANDENTOP GILROY J.;AZIMI HAMID R. |
| 分类号 |
H01L21/48;H01L21/68;H01L23/00;H01L23/485;H01L23/498;H05K3/32;H05K3/38;H05K3/40;(IPC1-7):H05K7/08 |
主分类号 |
H01L21/48 |
| 代理机构 |
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