Semiconductor substrate cleaning method in integrated circuit manufacture, involves moving separation plate formed with exhaust path between cleaning and drying rooms, for separating both rooms, after moving wafer support to drying room

摘要

The substrate or wafer is placed in a cleaning room (100) and cleaning solution is supplied to clean the substrate. A separation plate (400) formed with an exhaust path (145) is moved between the cleaning room and a drying room (200) for separating both the rooms, after moving a wafer support (300) to the drying room. The drying fluid is supplied to the drying room to dry the cleaned substrate. An independent claim is also included for apparatus for cleaning semiconductor substrate.