INTERCONNECT SYSTEM

摘要

Disclosed herein are backplane interconnect systems that use surface mount technology for mating conductive pins (404) in a header connector (400) to surface mount pads (36) on a printed circuit board (34). In particular, the interconnect system uses a plurality of conductive pins (404) that are not fully inserted into the body of the header connector, thus allowing them to move during mating with a printed circuit board. In this way, the interconnect system exhibits self-leveling characteristics.