| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate frame which can be separated into an individual semiconductor device without damaging the cut surface, and to provide a method for manufacturing a semiconductor device using the substrate frame. <P>SOLUTION: A slit 15 longer than a side of a wiring substrate region 11 is formed so as to hang over an ambilateral suspensory substrate region 13 extending in a transferring direction between the adjacent region 11 of a substrate frame. A semiconductor chip is adhered to a mounting region 11a at a center of the region 11, and a pad 1a formed in the region 11 and a pad to which the semiconductor chip corresponds are connected by a wire. Further, a sealing region 11b in the region 11 on which the semiconductor chip or the like are mounted is sealed by a resin sealer. After that, a dividing line between the region 11 and the region 13 is saw-cut by a rotating saw and the semiconductor device is individually separated. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
