| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrathin copper foil with a carrier which has few pinholes and small surface roughness and which has the thickness of less than 5μm, and to provide the method of producing the foil, and further to provide a printed circuit board for a fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultrathin copper foil with a carrier. SOLUTION: The method of producing an ultrathin copper foil with a carrier is performed by stacking a peeling layer and an ultrathin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0μm by mechanical polishing, chemical polishing, electrochemical dissolution, plating or a method combining two or more thereamong. COPYRIGHT: (C)2005,JPO&NCIPI |
