发明名称 ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve reliability, and to reduce man-hours by conducting high accuracy soldering of a case body to a circuit board. SOLUTION: The electronic apparatus comprises a circuit board 3 with electronic components packaged thereon and a case body 4 that houses the circuit board 3 therein and is integrally formed with a plurality of downward protruding connection terminals 11. A solder control portion 12 is formed in the top of each connection terminal 11 and the solder control portions 12 are filled with excessive solders stuck on the connection terminals 11, when soldering the case body 4 and the circuit board 3. Therefore, the solder control portion 12 is formed in each of the connection terminals 11 to suppress the generation of a horn-like solder caused by excessive solders. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005079419(A) 申请公布日期 2005.03.24
申请号 JP20030309650 申请日期 2003.09.02
申请人 MITSUMI ELECTRIC CO LTD 发明人 IKEDA ETSUHISA;NISHIYAMA YUJI
分类号 H05K3/34;H05K1/18;(IPC1-7):H05K1/18 主分类号 H05K3/34
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