| 摘要 |
PROBLEM TO BE SOLVED: To suppress an increase in chip area incident to an increase in circuit scale. SOLUTION: The semiconductor device is provided, between a plurality of chips 2 formed on a wafer 1, with a test circuit including a TAP 3 for accessing an objective circuit 5 in a chip externally and testing the circuit 5. COPYRIGHT: (C)2005,JPO&NCIPI
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