| 发明名称 |
MANUFACTURING METHOD FOR NONCONTACT IC TAG |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a noncontact IC tag that can carry out the positioning and mounting work of an IC chip readily. <P>SOLUTION: An insulating marginal wall 25 that forms storage space 26 is provided at the end part of one conductive sheet 14a. In the storage space 26 of this marginal wall 25, an IC chip 20 having electrodes 21 and 22 on both sides and a granular adhesive agent 27 are stored. The other conductive sheet 14b is located on the marginal wall 25 provided at one conductive sheet 14a. While the granular adhesive agent 27 melts and one conductive sheet 14a is adhered to the other conductive sheet 14b, the IC chip 20 is secured as well. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005078495(A) |
申请公布日期 |
2005.03.24 |
| 申请号 |
JP20030310134 |
申请日期 |
2003.09.02 |
| 申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
TSUCHIYA TERUNAO;IGARASHI AKIHIKO |
| 分类号 |
G06K19/077;G06K19/07;H01L21/56 |
主分类号 |
G06K19/077 |
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