发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR HARD COAT
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is curable by an active energy ray, a cured film of which has good adhesion to a plastic and has high hardness, and a film having the cured film of which has low curling properties and hardly causes crack. <P>SOLUTION: The photosensitive resin composition comprises 10-80 wt.%, in terms of solid content, of (A) an ethylenically unsaturated group-containing polyester dendrimer which is characterized in that it is a reaction product of (a) a polyester polyol dendrimer compound having 6 or more of reactive hydroxy groups in one of the molecule and (b) an ethylenically unsaturated group-containing monocarboxylic acid, 0.5-20 wt.% of (B) a photopolymerization initiator, and 10-60 wt.% of (C) a reactive diluent. There is obtained a hard coat film by coating the photosensitive resin composition onto a substrate and curing it by an active energy ray. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005076005(A) 申请公布日期 2005.03.24
申请号 JP20030311376 申请日期 2003.09.03
申请人 NIPPON KAYAKU CO LTD 发明人 KAMETANI HIDETERU;MATSUO YUICHIRO;KOYANAGI TAKAO
分类号 C08J7/04;C08F290/06 主分类号 C08J7/04
代理机构 代理人
主权项
地址