| 摘要 |
To refine an electrical or electronic component (100) having at least one discrete or integrated device (20) formed from a wafer (10), in plate or disk form, of semiconductive or insulating material, the front face (20v) of which device (20) has at least one overhanging and/or protruding and in particular ball-shaped or spherical electrode (40) and is encapsulated by at least one front-face encapsulant (60v; 70v; 80v), the side faces (20s) of which device (20) are at least partly encapsulated by at least one side-face encapsulant (70s; 80s), and the rear face (20r) of which device (20) is encapsulated by at least one rear-face encapsulant (70r; 80r), and to refine a method of producing the same, in such a way that, with the aim of widening the possible uses and applications, electrical contact is made not solely with the front face (20v) of the device (20) that is to be housed in the plastics package (60v, 70v, 80v, 70s, 80s, 70r, 80r) of very small dimensions, it is proposed that both the side-face encapsulant (70s) and the rear-face encapsulant (70r) be formed at least partly and/or at least of layers, but with the parts and/or layers connected, of electrically conducting or electrically conductive material.
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