发明名称 |
Method for manufacturing electronic device including package |
摘要 |
In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating process are removed by chemical polishing. A semiconductor sensor chip is inserted in the package body through the opening and fixed. Then, the lid 70 is attached to the package body. |
申请公布号 |
US2005062067(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040941929 |
申请日期 |
2004.09.16 |
申请人 |
KUNDA TOMOHITO;FUKURAI TSUKASA |
发明人 |
KUNDA TOMOHITO;FUKURAI TSUKASA |
分类号 |
H01L23/02;B81C3/00;G01P1/02;G01P15/08;G01P15/125;H01L21/48;H01L23/057;H01L31/0203;(IPC1-7):H01L31/020 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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