发明名称 |
Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool |
摘要 |
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
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申请公布号 |
US6869343(B2) |
申请公布日期 |
2005.03.22 |
申请号 |
US20010026504 |
申请日期 |
2001.12.19 |
申请人 |
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发明人 |
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分类号 |
B23B27/04;B23C5/08;B23C5/10;B23Q1/52;B23Q16/04;B24B37/04;B24D13/14;B24D18/00;(IPC1-7):B24B7/00 |
主分类号 |
B23B27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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