发明名称 Crystal layer separation method, laser irradiation method and method of fabricating devices using the same
摘要 Disclosed are a crystal layer separation method capable of separating a crystal layer formed on a substrate therefrom without occurrence of any crack, and a laser irradiation method used therefor, and a method of fabricating devices using the same. The crystal layer separation method includes the step of separating a crystal layer made from a GaN based compound formed on a sapphire substrate therefrom by irradiating the crystal layer with a laser beam from the back surface of the substrate, wherein the crystal layer is irradiated with the laser beam in a line-shape. In this method, an irradiation width of the laser beam is preferably equal to or less than a thickness of the crystal layer, and the laser beam preferably has a light intensity distribution smoothened in the width direction.
申请公布号 US6870125(B2) 申请公布日期 2005.03.22
申请号 US20020308935 申请日期 2002.12.03
申请人 SONY CORPORATION 发明人 DOI MASATO;IWAFUCHI TOSHIAKI;OOHATA TOYOHARU
分类号 B23K26/06;B23K26/073;H01L21/20;H01L21/762;H01L33/32;(IPC1-7):B23K26/00 主分类号 B23K26/06
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