| 发明名称 |
Methods of making microelectronic assemblies including compliant interfaces |
| 摘要 |
An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.
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| 申请公布号 |
US6870272(B2) |
申请公布日期 |
2005.03.22 |
| 申请号 |
US20020123547 |
申请日期 |
2002.04.16 |
| 申请人 |
TESSERA, INC. |
发明人 |
KOVAC ZLATA;MITCHELL CRAIG;DISTEFANO THOMAS;SMITH JOHN |
| 分类号 |
H01L21/56;H01L21/60;H01L23/31;H01L23/48;H01L23/498;H05K1/11;H05K3/36;H05K3/40;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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