| 摘要 |
A spin etcher is provided to prevent the contamination of a wafer and to restrain over-etching due to the residuals of etchant by spraying a cleaning solution to the center of a rotating wafer. A spin etcher includes a rotation part with a spin head(100a) for rotating a wafer, a chemical spraying part for spraying chemicals onto the wafer, and a cleaning solution spraying part. The chemical spraying part includes a first support shaft(200c), a nozzle arm(200b) connected with the first support shaft, and a first spraying nozzle(200a) connected with one end of the nozzle arm. The cleaning solution spraying part includes a second support shaft and a second spraying nozzle. The second spraying nozzle(300a) is fixed to spray a cleaning solution to the center of the wafer.
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