| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing a polishing pad having good flatness, in-plane uniformity and polishing rate with a slight change in the polishing rate and further excellent life characteristics and to provide a method for producing a semiconductor device using the polishing pad. <P>SOLUTION: The polishing pad has a polishing layer composed of a polyurethane resin foam having fine cells. The polyurethane resin foam comprises a hydrophobic isocyanate-terminated prepolymer (A) containing a hydrophobic high-molecular weight polyol component without having a hydrophilic group other than a hydroxy group and an isocyanate component as a raw material component, a hydrophilic isocyanate-terminated prepolymer (B) containing a hydrophilic high-molecular weight polyol component having an ethylene oxide unit (CH<SB>2</SB>CH<SB>2</SB>O) and an isocyanate component as a raw material component and a chain extender as a raw material component. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
