| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the manufacturing yield of a solid-state imaging apparatus by arranging, on the external side of a sealing body, the holes formed on a substrate for the aligning between an imaging element and a frame in the manufacturing steps of the solid-state imaging apparatus. <P>SOLUTION: In the method of manufacturing a camera module including a CMOS image sensor, a semiconductor chip 2A for optical sensor is mounted on the optical component mounting surface of a mother board 1 of a wiring substrate, and a barrel 4 is bonded to the mother board 1 of wiring substrate to cover the semiconductor chip 2A after connection of a bonding wire. For the positioning of this barrel 4 and the mother board 1 of wiring substrate, a positioning pin 4C1 provided on the barrel 4 and a through-hole 16 which is provided on the mother board 1 of wiring substrate for insertion of the pin 4C1 are provided on the external side of the bonding surface between the barrel 4 and mother board 1 of wiring substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
