| 摘要 |
PROBLEM TO BE SOLVED: To restrain a discharge vessel from rising in temperature when a film is deposited on a substrate inside the vessel so as to keep the discharge vessel and a substrate at a temperature optimal for depositing the film. SOLUTION: A deposition film forming device is equipped with the discharge vessel that forms a discharge space inside a vacuum vessel, an electrode that is arranged separating from the substrate by a prescribed distance inside the discharge vessel, a first cooling means located between the discharge vessel and the rear of the electrode, and a first heating means located between the discharge vessel and the vacuum vessel. COPYRIGHT: (C)2005,JPO&NCIPI
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