| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a photomask is required at every form and every process, that much cost and time are required for correspondence of small quantity many forms and a sudden change of a chip size, and that production efficiency is not good although photolithography is main in patterning of window formation in a manufacturing method of a mesa-type semiconductor device. SOLUTION: Selective diffusion formation of dispersing agent application by a nozzle system, pattern formation of a resist material and selective implantation formation of a passivation material are performed. Thus, production man-day is improved and the chip size is easily changed. Consequently, productivity improves. COPYRIGHT: (C)2005,JPO&NCIPI
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