发明名称 |
Connection device and method of forming a connection device |
摘要 |
A connection device includes a plurality of re-configurable vias that connect a first metal layer to a second metal layer. An actuating element is disposed between the first metal layer and the second metal layer. The actuating element changes the configuration of the plurality of re-configurable vias to change the plurality of re-configurable vias between a conductive state and a non-conductive state.
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申请公布号 |
US2005056937(A1) |
申请公布日期 |
2005.03.17 |
申请号 |
US20030662709 |
申请日期 |
2003.09.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FRANK DAVID J.;GUARINI KATHRYN W.;MURRAY CHRISTOPHER B.;WANG XINLIN;WONG HON-SUM PHILIP |
分类号 |
H01L23/522;H01L23/525;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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