| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling system of a "Mobile Pentium 4" with configuration of low cost as compared with a case where a dedicated cooling module is developed for cooling of the "Mobile Pentium 4", when the "Mobile Pentium 4" is adopted as a CPU of a computer or the like for FA. SOLUTION: A cooling module mounting board 5 is prepared. In the board 5, a hole 5a is formed whose shape is almost identical to a CPU socket 2 which connects a CPU (the "Mobile Pentium 4") 3, and pawls 5c, 5d are installed which are formed by the same position dimentionality as pawls for cooling module installation which are formed on a socket for a "Pentium III". A cooling module 4 for the "Pentium III" is attached to the pawls 5c, 5d of the cooling module mounting board 5 which is positioned on the almost same surface with the upper surface of the CPU 3 by using a spacer 10 and fixed on a printed wiring board 1. As a result, the cooling module 4 for the "Pentium III" is diverted, and the CPU 3 can be cooled. COPYRIGHT: (C)2005,JPO&NCIPI |
