发明名称 Thermal processing apparatus
摘要 In a thermal processing apparatus irradiating a substrate with light from a lamp for heating the substrate, an opening is formed in a reflector for mounting a camera unit. The camera unit images three portions of an auxiliary ring supporting the substrate, for obtaining the position of the center of the auxiliary ring before the thermal processing apparatus receives the substrate therein. The camera unit further images the substrate for obtaining the position of the center of the substrate before the thermal processing apparatus receives the substrate therein and places the same on the auxiliary ring. The thermal processing apparatus moves the substrate so that the center thereof coincides with the center of the auxiliary ring, and thereafter places the former on the latter. Thus, the auxiliary ring can be so designed as to reduce overlaps of the auxiliary ring and the outer edge of the substrate while the overlaps can be rendered uniform over the entire circumference of the substrate for improving temperature uniformity of the substrate.
申请公布号 US6868302(B2) 申请公布日期 2005.03.15
申请号 US20030394895 申请日期 2003.03.21
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 KOBAYASHI TOSHIYUKI;KOYAMA YOSHIHIRO;TAKAHASHI MITSUKAZU
分类号 H01L21/00;H01L21/324;H01L21/68;(IPC1-7):G06F19/00 主分类号 H01L21/00
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