| 摘要 |
The method for assembling and connecting a conductor element (3) to a pad of the other constituent of the electronic device (1) includes the formation of at least one outgrowth or projection (7) on the conductor element (3), interposing an assembling material (8) in a full layer substantially parallel to the plane of contact (6) and over the projection (7), which is substantially perpendicular to the plane of contact, and bringing the conductor element (3) in galvanic contact with the pad of the other constituents, where the projection (7) is adjusted with the assembling material (8). The interposition of the material (8) is effected by depositing the material in a full layer substantially parallel to the plane of contact and without spacing. The other constituent is integrated with a substrate in the form of a tape extended in longitudinal direction. The formation of projections (7) is preceded by the fixation of conducting ductile material on the conductor element (3), and the modelling of the ductile material according to a desired profile of the projection. The formation of the projection is by a superposition in three stages. The formation step includes the formation of several projections on the conductor element (3), according to a pattern without alignment in the plane of contact, for example with the projections positioned in an isostatic manner in the plane of contact. The conductor element (3) comprises an adhesive material for the formation of the projections (7) deposited jointly with the material for fastening and connection of the conductor element of the electronic component such as a chip, memory or interface. The projections (7) are flexible and the Young's modulus is below 100 MPa, for example in the range 10-50 MPa. The electronic device (claimed) is made by implementing the method (claimed). The device comprises at least one input/output interface for transmitting information by use of ohmic contacts (15) and/or an antenna. The device is a module for an intelligent portable object such as chip card, electronic tag, or similar. An equipment (claimed) for the production of the electronic device implements the method. |
