PATTERN INSPECTION METHOD USING MONITORING-PATTERN MODULE FOR DETECTING PATTERN UNIFORMITY WITHOUT MEASURING DIRECTLY PATTERN SIZE AND LINE WIDTH

摘要

PURPOSE: A pattern inspection method using a monitoring-pattern module is provided to detect a notching state and a bridging state in gaps between monitoring patterns by inserting a plurality of monitoring pattern modules in a photo-lithography process. CONSTITUTION: A plurality of monitoring pattern modules including a plurality of monitoring patterns are printed on a plurality of positions on a surface of a wafer by performing a photo-lithography process(120). A gap inspection process is performed to inspect a gap between the monitoring patterns within the monitoring pattern modules(130). Pattern uniformity of the wafer is detected by using a gap state such as a notching state and a bridging state(140).