| 摘要 |
<p>There is provided a method for manufacturing an electronic part having a circuit element (3) formed on a surface of a ceramic substrate (1) and conductive balls (2) as an electronic part terminal. After the ceramic substrate (1) and the conductive balls (2) are fixed, the ceramic substrate (1) is appropriately divided. For this, the manufacturing method includes: a first step for forming the circuit element (3) on the surface of a large-scale ceramic substrate (1) having division grooves (4) arranged vertically and horizontally on the surface; a second step for fixing the conductor balls (2) to the terminal portion of the circuit element (3); and a third step for dividing the substrate (1) by applying stress to the substrate (1) so as to open the division grooves (4). The first, the second, and the third step are performed in this order. The application of stress in the third step is performed substantially equally to a plenty of conductive balls (2) or no stress is applied to the conductive balls (2).</p> |
