ENHANCED TAB TAPE FOR REALIZING FINE PITCH AND TCP USING THE SAME

摘要

PURPOSE: A TAB(Tape Automated Bonding) tape and a TCP(Tape Carrier Package) using the same are provided to realize fine pitch in a semiconductor device by improving the structure of the TAB tape. CONSTITUTION: A TAB tape includes a base film, a fist metal line pattern, and a second metal line pattern. The base film(330) is made of an insulating substance. A via hole(360) is formed at a predetermined portion of the base film. The first metal line pattern(320) is formed on a first surface of the base film. The second metal line pattern(340) is formed on a second surface of the base film. The second metal line is electrically connected with a terminal of the first surface of the base film through a conductive material of the via hole. The first and second metal line patterns are overlapped with each other.