发明名称 |
METHOD OF ANNEALING SUBSTRATE FOR LIQUID CRYSTAL OR FOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide an annealing method which allows the manufacture of a high-performance liquid crystal or semiconductor device by easily reducing an amount of particles attaching to the surface of a substrate during annealing, while preventing problems in a wet treatment to be conducted after annealing, when a liquid crystal substrate which is such that a polysilicon or amorphous silicon thin film is formed on a transparent plate made of glass or the like, and which is to be used for a liquid crystal display or a wafer made of silicon or the like to be used for semiconductor manufacturing (hereinafter called "substrate") is stored in a container that can be sealed up and is given high-temperature annealing. SOLUTION: The substrate for liquid crystal or for semiconductor is stored in the container which can be sealed up. The substrate is annealed at a high temperature in such a posture that it is inclined at a certain angle from a state placed horizontally with its front face upside. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005064334(A) |
申请公布日期 |
2005.03.10 |
申请号 |
JP20030294544 |
申请日期 |
2003.08.18 |
申请人 |
ISHIKAWAJIMA HARIMA HEAVY IND CO LTD |
发明人 |
MURAYAMA TAKAHIKO;KAWAKAMI RYUSUKE;YAMAMOTO NAOYA;WATANABE TOMOYUKI;YOSHINOUCHI ATSUSHI |
分类号 |
H01L21/20;H01L21/316;H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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地址 |
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